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PSG Laser Solutions for Advanced Packaging

Achieving both high precision and flexibility. The new generation "DR20x0 / DR30x0" series is born.

The new generation of PSG "DR20x0 / DR30x0" realizes the optimal solution for advanced PCB packaging: 1. ABF substrate drilling 2. Ultra-HDI PCB fine drilling 3. IC substrate drilling 4. Rigid substrate processing 5. Cavity creation 6. Laser trenching

  • Circuit board processing machine
  • Advanced packaging laser solutions

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